Title:
RESIN COMPOSITION FOR ENCAPSULATION AND METHOD FOR PRODUCING SINGLE-SIDED-ENCAPSULATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/182485
Kind Code:
A1
Abstract:
This resin composition for encapsulation is used to produce a single-sided-encapsulation-type structure by single-sided encapsulation of a mother board on which at least one electronic device is mounted. This resin composition for encapsulation comprises a trifunctional or higher epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a wax and has a mold shrinkage rate of 0.1% or less.
Inventors:
MATSUO MAKOTO (JP)
Application Number:
PCT/JP2023/011749
Publication Date:
September 28, 2023
Filing Date:
March 24, 2023
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
H01L23/29; C08K3/013; C08L63/00; C08L91/06; H01L23/31
Foreign References:
| JP2011195841A | 2011-10-06 | |||
| JP2016031985A | 2016-03-07 | |||
| JP2006100489A | 2006-04-13 | |||
| JP2019026715A | 2019-02-21 | |||
| JP2022003130A | 2022-01-11 | |||
| JP2011258603A | 2011-12-22 | |||
| JP2018172545A | 2018-11-08 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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