Title:
RESIN COMPOSITION FOR ENCAPSULATION, REARRANGED WAFER, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2019/004458
Kind Code:
A1
Abstract:
Provided is a resin composition for encapsulation, the resin composition satisfying at least one among (1)-(4): (1) contains a curable resin component, an elastomer component, and a filler, wherein the cured product of the resin composition has an elastic modulus of 1.0 GPa or less at 260°C; (2) contains a curable resin component, an elastomer component, and a filler, wherein the content of the elastomer component is 1.0-8.0 mass% with respect to the total mass of the resin composition; (3) contains a curable resin component, a compound having a siloxane bond, and a filler, wherein the proportion of the compound having a siloxane bond is at least 20 mass% with respect to the total mass of the curable resin component and the compound having a siloxane bond; and (4) contains a curable resin component, a compound having a siloxane bond, and a filler, wherein the resin composition is used for wafer level packages.
Inventors:
INOUE HIDETOSHI (JP)
NAMIKI YUJI (JP)
NAMIKI YUJI (JP)
Application Number:
PCT/JP2018/024935
Publication Date:
January 03, 2019
Filing Date:
June 29, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L63/00; C08K3/013; C08L21/00; C08L83/10; H01L23/29; H01L23/31
Domestic Patent References:
WO2016136741A1 | 2016-09-01 |
Foreign References:
JP2016169367A | 2016-09-23 | |||
JP2015067788A | 2015-04-13 | |||
JP2016166373A | 2016-09-15 | |||
JP2008163116A | 2008-07-17 | |||
JPH04216855A | 1992-08-06 | |||
JPH07126490A | 1995-05-16 | |||
JP2003292739A | 2003-10-15 | |||
JPH07242799A | 1995-09-19 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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