Title:
RESIN COMPOSITION EXCELLING IN ANTICORROSIVE AND/OR CONDUCTIVE PERFORMANCE AND MEMBER COATED WITH RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2006/073067
Kind Code:
A1
Abstract:
A resin composition comprised of a resin compounded with clad scale micropowder of different types of metals containing at least either (a) Zn and/or Al formed into scaly micropowder or (b) Cu and/or Ni formed into scaly micropowder. The resin composition can be easily applied to a base material while taking advantage of the conventional corrosion preventive (anticorrosive) method. The resin composition exhibits excellent anticorrosive and conductive characteristics equivalent to or higher than those of hot-dip plating. The resin composition obviates the occurrence of any thermal brittleness in base materials and requires no additional treatments, such as pore sealing treatment. The resin composition is available as a nonpolluting anticorrosive agent that even in the event of thick coating, is free of anxiety about residual stress and permits workmanship capable of coping with aging deterioration. The resin composition is available as a nonpolluting electromagnetic wave shielding agent that solves problems of conventional electromagnetic wave shielding technology and exhibits electromagnetic wave shielding characteristics with a uniform coating film structure formed through conventional application method while avoiding the need to select locality of execution. Moreover, there is disclosed a resin-coated member having a base material surface coated with this resin composition.
Inventors:
KOBAYASHI KAZUO (JP)
Application Number:
PCT/JP2005/023612
Publication Date:
July 13, 2006
Filing Date:
December 22, 2005
Export Citation:
Assignee:
SHIELDTECHS INC (JP)
KOBAYASHI KAZUO (JP)
KOBAYASHI KAZUO (JP)
International Classes:
C08L101/00; C08K3/02; C08K7/00; C08L83/00; C09D5/00; C09D183/00; C09D201/00; H05K9/00
Foreign References:
| JP2004168986A | 2004-06-17 | |||
| JPS63141732A | 1988-06-14 | |||
| JPH05163402A | 1993-06-29 |
Attorney, Agent or Firm:
Ueki, Kyuichi (1-16 Dojima 2-chome, Kita-k, Osaka-shi Osaka 03, JP)
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