Title:
RESIN COMPOSITION FOR EXPANSION MOLDING
Document Type and Number:
WIPO Patent Application WO/2012/091098
Kind Code:
A1
Abstract:
Provided is a resin composition for expansion molding, which can achieve a high expansion ratio and enables the production of an expansion-molded article having greatly improved touch and greatly improved vibration-damping properties.
The present invention is a resin composition for expansion molding, comprising: thermally expansive microcapsules each of which comprises a shell comprising an epoxy resin and a volatile expansion agent encapsulated in the shell as a core agent; a thermoplastic resin; and a curable compound which has, in the molecule thereon, at least two of at least one kind of functional groups selected from the group consisting of a carboxyl group, a hydroxy group, an amino group, an amide group and an acid anhydride group.
Inventors:
YAMAUCHI HIROSHI (JP)
MORITA HIROYUKI (JP)
NATSUI HIROSHI (JP)
MORITA HIROYUKI (JP)
NATSUI HIROSHI (JP)
Application Number:
PCT/JP2011/080414
Publication Date:
July 05, 2012
Filing Date:
December 28, 2011
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
YAMAUCHI HIROSHI (JP)
MORITA HIROYUKI (JP)
NATSUI HIROSHI (JP)
YAMAUCHI HIROSHI (JP)
MORITA HIROYUKI (JP)
NATSUI HIROSHI (JP)
International Classes:
C08J9/32; C08G59/20; C08K9/10; C08L101/00
Domestic Patent References:
| WO2003099955A1 | 2003-12-04 | |||
| WO1999043758A1 | 1999-09-02 |
Foreign References:
| JP2003128830A | 2003-05-08 | |||
| JP2009203451A | 2009-09-10 | |||
| JP2005343967A | 2005-12-15 | |||
| JP2003133343A | 2003-05-09 | |||
| JP2005029607A | 2005-02-03 | |||
| JP4226524B2 | 2009-02-18 |
Other References:
See also references of EP 2660283A4
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
Patent business corporation Yasutomi international patent firm (JP)
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Claims: