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Title:
RESIN COMPOSITION AND FILAMENT-LIKE MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2018/123763
Kind Code:
A1
Abstract:
A resin composition used in a fabrication material for a fused deposition modeling 3D printer, said resin composition characterized by containing a polylactic acid (A) and a polyamide copolymer (B), wherein the mass ratio (A/B) of the polylactic acid (A) to the polyamide copolymer (B) is 90/10 to 25/75.

Inventors:
USUI AZUSA (JP)
NOGUCHI SHOTA (JP)
MATSUOKA FUMIO (JP)
NAKATANI TAKATOSHI (JP)
Application Number:
PCT/JP2017/045711
Publication Date:
July 05, 2018
Filing Date:
December 20, 2017
Export Citation:
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Assignee:
UNITIKA LTD (JP)
International Classes:
C08L67/04; B29C64/118; B33Y70/00; C08L77/00; C08L101/16; D01F6/62; D01F6/92
Domestic Patent References:
WO2015037574A12015-03-19
WO2018003379A12018-01-04
Foreign References:
JP2015150781A2015-08-24
JP2014524858A2014-09-25
JP2010100047A2010-05-06
JP2016020401A2016-02-04
JP2016094679A2016-05-26
US20160069001A12016-03-10
JP2007217445A2007-08-30
Attorney, Agent or Firm:
MORIMOTO INT'L PATENT OFFICE (JP)
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