Title:
RESIN COMPOSITION AND FILAMENT-LIKE MOLDED BODY FORMED FROM SAME
Document Type and Number:
WIPO Patent Application WO/2019/189328
Kind Code:
A1
Abstract:
A resin composition for modeling materials for fused deposition modeling 3D printers, which is characterized by containing: a polyarylate resin (A) and a polyester resin (B); or the polyarylate resin (A) and a polyamide resin (C); or the polyarylate resin (A) and a polycarbonate resin (D).
Inventors:
USUI AZUSA (JP)
KAMIKAWA HIROO (JP)
MATSUOKA FUMIO (JP)
KUMAZAWA SHOHEI (JP)
KAMIKAWA HIROO (JP)
MATSUOKA FUMIO (JP)
KUMAZAWA SHOHEI (JP)
Application Number:
PCT/JP2019/013125
Publication Date:
October 03, 2019
Filing Date:
March 27, 2019
Export Citation:
Assignee:
UNITIKA LTD (JP)
International Classes:
B29C64/314; B29C64/118; B33Y70/00; C08K3/013; C08K3/36; C08K5/098; C08K5/49; C08L67/00; C08L67/03; C08L69/00; C08L77/00
Domestic Patent References:
| WO2007063795A1 | 2007-06-07 |
Foreign References:
| JP2016028887A | 2016-03-03 | |||
| JP2002302596A | 2002-10-18 | |||
| JPH06106526A | 1994-04-19 | |||
| JP2002047403A | 2002-02-12 | |||
| JP2011068735A | 2011-04-07 | |||
| JPH10176102A | 1998-06-30 | |||
| JP2018002908A | 2018-01-11 | |||
| JP2017217881A | 2017-12-14 | |||
| JP2016210947A | 2016-12-15 | |||
| JPS504B1 | 1975-01-06 |
Other References:
See also references of EP 3778190A4
Attorney, Agent or Firm:
MORIMOTO INT'L PATENT OFFICE (JP)
Download PDF:
Previous Patent: PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND APPLICATION OF THESE
Next Patent: INSULATED CIRCUIT BOARD WITH HEAT SINK
Next Patent: INSULATED CIRCUIT BOARD WITH HEAT SINK