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Patent Searching and Data


Title:
RESIN COMPOSITION, FILAMENT AND RESIN POWDER FOR THREE-DIMENSIONAL PRINTER, AND SHAPED OBJECT AND PRODUCTION RPOCESS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/043231
Kind Code:
A1
Abstract:
Provided are: a resin composition which is easy to produce and which, when shaped with a three-dimensional printer, can give shaped objects reduced in interlaminar separation, warpage, and shrinkage; a filament and a resin powder which are for use in three-dimensional printers; a shaped object; and a process for producing the shaped object. The resin composition is characterized by comprising inorganic fibers having an average fiber length of 1-300 μm and an average aspect ratio of 3-200 and a thermoplastic resin and by being a shaping material for use in three-dimensional printers.

Inventors:
INADA, Kousuke (2-2, Kandatsukasamachi, Chiyoda-k, Tokyo 48, 〒1010048, JP)
OKADA, Masagoro (463, Kagasuno, Kawauchi-cho, Tokushima-sh, Tokushima 93, 〒7710193, JP)
TAKARADA, Akira (463, Kagasuno, Kawauchi-cho, Tokushima-sh, Tokushima 93, 〒7710193, JP)
Application Number:
JP2017/030040
Publication Date:
March 08, 2018
Filing Date:
August 23, 2017
Export Citation:
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Assignee:
OTSUKA CHEMICAL CO., LTD. (2-27, Otedori 3-chome Chuo-ku, Osaka-sh, Osaka 21, 〒5400021, JP)
International Classes:
C08L101/00; B29C64/153; B33Y70/00; C08K3/24; C08K3/34; C08K7/04
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (Chuo Odori FN Bldg, 3-8 Tokiwamachi 1-chome, Chuo-ku, Osaka-sh, Osaka 28, 〒5400028, JP)
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