Title:
RESIN COMPOSITION, FILM, COMPOSITE MATERIAL, MOVABLE BODY, AND MATERIAL FOR THREE-DIMENSIONAL SHAPING USE
Document Type and Number:
WIPO Patent Application WO/2021/066011
Kind Code:
A1
Abstract:
Provided is a resin composition having excellent heat resistance, melt moldability and secondary processability. A resin composition comprising a polyaryletherketone resin (A) and a poly(ether imide sulfone) resin (B), wherein the polyaryletherketone resin (A) and the poly(ether imide sulfone) resin (B) are dissolved in each other. The polyaryletherketone resin (A) is preferably a polyetherketoneketone resin having a repeating unit (a-1) represented by formula (1A) and a repeating unit (a-2) represented by formula (2A), and the resin composition has a single glass transition temperature.
Inventors:
HASUIKE MAHO (JP)
YAMASUE NAO (JP)
YAMASUE NAO (JP)
Application Number:
PCT/JP2020/037149
Publication Date:
April 08, 2021
Filing Date:
September 30, 2020
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08L71/08; B29C64/118; B33Y70/00; C08J5/04; C08J5/18; C08K7/02; C08L79/08
Foreign References:
| US20110104417A1 | 2011-05-05 | |||
| JP2010510377A | 2010-04-02 | |||
| US20100159224A1 | 2010-06-24 | |||
| JP2015049269A | 2015-03-16 | |||
| JP2009508998A | 2009-03-05 | |||
| JP2009508997A | 2009-03-05 | |||
| US20170362386A1 | 2017-12-21 | |||
| JP2006341596A | 2006-12-21 | |||
| JP2004182832A | 2004-07-02 | |||
| JP2009508997W | ||||
| JPS61195122A | 1986-08-29 | |||
| JPS62129313A | 1987-06-11 | |||
| US4175175A | 1979-11-20 | |||
| US3803085A | 1974-04-09 | |||
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| JP2019181196A | 2019-10-24 |
Other References:
See also references of EP 4039747A4
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (JP)
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