Title:
RESIN COMPOSITION, RESIN COMPOSITION FILM, CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/032467
Kind Code:
A1
Abstract:
Provided are: a resin composition having excellent sensitivity during pattern processing and having excellent adhesion to inorganic materials; a resin composition film; and a semiconductor device employing the same. The resin composition contains a polymer compound as component (A), a cationic polymerizable compound as component (B), a cationic polymerization initiator as component (C), and a silane coupling agent as component (D), the resin composition being characterized in that component (D) has a carboxyl group and/or an acid anhydride group.
Inventors:
KATO KEIGO (JP)
MATSUMURA KAZUYUKI (JP)
TATEOKA YOSHIKO (JP)
SHIMADA AKIRA (JP)
MATSUMURA KAZUYUKI (JP)
TATEOKA YOSHIKO (JP)
SHIMADA AKIRA (JP)
Application Number:
PCT/JP2022/026925
Publication Date:
March 09, 2023
Filing Date:
July 07, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L101/02; C08K5/541; C08L63/00; C08L77/00; C08L79/08; G03F7/004; G03F7/038; H01L23/14
Foreign References:
| JP2020101650A | 2020-07-02 | |||
| JP2021047378A | 2021-03-25 | |||
| JP2021076728A | 2021-05-20 | |||
| JP2021055055A | 2021-04-08 |
Download PDF: