Title:
RESIN COMPOSITION, RESIN FILM, AND IMAGE DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/156868
Kind Code:
A1
Abstract:
Provided are: a resin composition characterized by having an amount of outgassing generation when heated for 24 hours at 100°C of no greater than 100 ppm, and a product of the loss tangent (tanδ1) measured at the conditions of 80°C and 0.1 Hz and the thickness (d (μm)) at room temperature when formed into a film shape satisfying the relationship represented by formula (I); a resin film having at least a resin layer formed from the resin composition; and an image display device resulting from interposing the resin layer between a display panel that displays images and a protective plate provided to the surface of the display panel. Formula (I): 7 < (tanδ1×d) < 250.
Inventors:
ASANUMA TAKUMI (JP)
MIEDA TETSUYA (JP)
ISHIGURO KUNIHIKO (JP)
MIEDA TETSUYA (JP)
ISHIGURO KUNIHIKO (JP)
Application Number:
PCT/JP2014/057496
Publication Date:
October 02, 2014
Filing Date:
March 19, 2014
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C08L101/12; C09J7/00; C09J201/00; G02F1/1335; G09F9/00
Foreign References:
| JP2005298703A | 2005-10-27 | |||
| JP2006010931A | 2006-01-12 | |||
| JP2003213067A | 2003-07-30 |
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
Toshizo Iida (JP)
Download PDF:
Previous Patent: LIQUID-SEALED VIBRATION PREVENTION DEVICE
Next Patent: BATTERY LIFE ESTIMATION METHOD AND BATTERY LIFE ESTIMATION DEVICE
Next Patent: BATTERY LIFE ESTIMATION METHOD AND BATTERY LIFE ESTIMATION DEVICE