Title:
RESIN COMPOSITION, RESIN FILM, LAMINATE, MULTILAYER PRINTED WIRING BOARD AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2018/008643
Kind Code:
A1
Abstract:
The present invention relates to a resin composition which contains: a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group that has at least two imide bonds; and a catalyst that contains at least one compound selected from the group consisting of imidazole compounds, phosphorus compounds, azo compounds and organic peroxides.
Inventors:
NAGAI YUKI (JP)
IRINO TETSUROH (JP)
KONDOU YUUSUKE (JP)
FUKUDA TOMIO (JP)
MIZUSHIMA ETSUO (JP)
TANIGAWA TAKAO (JP)
IRINO TETSUROH (JP)
KONDOU YUUSUKE (JP)
FUKUDA TOMIO (JP)
MIZUSHIMA ETSUO (JP)
TANIGAWA TAKAO (JP)
Application Number:
PCT/JP2017/024520
Publication Date:
January 11, 2018
Filing Date:
July 04, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L35/00; B32B15/08; B32B15/088; C08K5/14; C08K5/23; C08K5/3445; C08K5/49; C08L79/08; H05K1/03
Domestic Patent References:
WO2014181456A1 | 2014-11-13 |
Foreign References:
JP2013189644A | 2013-09-26 | |||
JP2015086343A | 2015-05-07 | |||
JP2013211348A | 2013-10-10 | |||
JP2017043767A | 2017-03-02 | |||
JP2017125128A | 2017-07-20 | |||
JP2016060870A | 2016-04-25 | |||
JPS5869046A | 1983-04-25 | |||
JPS6118937A | 1986-01-27 | |||
JP2008095061A | 2008-04-24 | |||
JP2012255059A | 2012-12-27 |
Other References:
See also references of EP 3483214A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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