Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION, RESIN FILM, LAMINATE, MULTILAYER PRINTED WIRING BOARD AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2018/008643
Kind Code:
A1
Abstract:
The present invention relates to a resin composition which contains: a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a divalent group that has at least two imide bonds; and a catalyst that contains at least one compound selected from the group consisting of imidazole compounds, phosphorus compounds, azo compounds and organic peroxides.

Inventors:
NAGAI YUKI (JP)
IRINO TETSUROH (JP)
KONDOU YUUSUKE (JP)
FUKUDA TOMIO (JP)
MIZUSHIMA ETSUO (JP)
TANIGAWA TAKAO (JP)
Application Number:
PCT/JP2017/024520
Publication Date:
January 11, 2018
Filing Date:
July 04, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L35/00; B32B15/08; B32B15/088; C08K5/14; C08K5/23; C08K5/3445; C08K5/49; C08L79/08; H05K1/03
Domestic Patent References:
WO2014181456A12014-11-13
Foreign References:
JP2013189644A2013-09-26
JP2015086343A2015-05-07
JP2013211348A2013-10-10
JP2017043767A2017-03-02
JP2017125128A2017-07-20
JP2016060870A2016-04-25
JPS5869046A1983-04-25
JPS6118937A1986-01-27
JP2008095061A2008-04-24
JP2012255059A2012-12-27
Other References:
See also references of EP 3483214A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: