Title:
RESIN COMPOSITION, RESIN FILM, LAYERED BODY, COVERLAY FILM, COPPER FOIL WITH RESIN, METAL-CLAD LAYERED BOARD AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/085329
Kind Code:
A1
Abstract:
This resin composition contains: (A) a thermoplastic resin that contains a structural unit derived from a tetracarboxylic anhydride component, and a diamine component containing, with respect to the total diamine component, at least 40 mol% of a dimer diamine composition having, as a main component, a dimer diamine in which two terminal carboxylic acid groups in dimer acid is substituted by a primary aminomethyl group or an amino group; and (B) at least one selected from an aromatic condensed phosphate ester, silica particles, and a liquid-crystalline polymer filler.
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Inventors:
NAKAJIMA YOSHITO (JP)
SUTO YOSHIKI (JP)
KAKISAKA KOTA (JP)
NISHIYAMA TEPPEI (JP)
DEAI HIROYUKI (JP)
TANAKA MUTSUHITO (JP)
SUTO YOSHIKI (JP)
KAKISAKA KOTA (JP)
NISHIYAMA TEPPEI (JP)
DEAI HIROYUKI (JP)
TANAKA MUTSUHITO (JP)
Application Number:
PCT/JP2020/039910
Publication Date:
May 06, 2021
Filing Date:
October 23, 2020
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
International Classes:
C08G73/10; C08J5/18; C08K3/36; C08K5/16; C08K5/49; C08K5/523; C08L67/03; C08L79/08; C08L101/12
Domestic Patent References:
| WO2018062404A1 | 2018-04-05 | |||
| WO2017150336A1 | 2017-09-08 |
Foreign References:
| JP2018090664A | 2018-06-14 | |||
| JP2018168372A | 2018-11-01 | |||
| JP2015160852A | 2015-09-07 | |||
| JP2013001730A | 2013-01-07 | |||
| JP2008266378A | 2008-11-06 | |||
| JP2016027132A | 2016-02-18 |
Attorney, Agent or Firm:
WATANABE Kazuhiro (JP)
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