Title:
RESIN COMPOSITION, RESIN FILM USING SAME, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/030413
Kind Code:
A1
Abstract:
One aspect of the present invention relates to a resin composition comprising an acrylic resin and a curing agent. The acrylic resin comprises a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B) of a (meth)acrylate having a cyano group, and a polymerization unit (C) of a (meth)acrylate having an isobornyl group. The weight average molecular weight of the acrylic resin is 50,000-3,000,000 inclusive. The storage modulus of a cured product of the acrylic resin at 200°C is 0.1 MPa to 3.5 MPa inclusive.
Inventors:
FUKAO TOMOHIRO
SAWADA TOMOAKI
MICHIGAMI KYOSUKE
SAWADA TOMOAKI
MICHIGAMI KYOSUKE
Application Number:
PCT/JP2021/028472
Publication Date:
February 10, 2022
Filing Date:
July 30, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08G59/20; B32B15/08; B32B15/082; B32B27/26; C08F20/32; C08J5/18; C08L63/00; H05K1/03
Domestic Patent References:
| WO2019189750A1 | 2019-10-03 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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