Title:
RESIN COMPOSITION AND FILM
Document Type and Number:
WIPO Patent Application WO/2007/099826
Kind Code:
A1
Abstract:
Disclosed is a resin composition which enables to obtain a film having excellent film formability, excellent bending resistance and low retardation. Specifically disclosed is a resin composition mainly containing an acrylic resin and also containing organic fine particles having an average particle diameter of not less than 0.01 μm but not more than 1 μm. The acrylic resin has a glass transition temperature of not less than 110˚C but not more than 200˚C, and each of the organic fine particles has a structural unit of a vinyl cyanide monomer and another structural unit of an aromatic vinyl monomer.
Inventors:
UEDA KENICHI
OTOME SHIGEO
NAKA AKIO
OTOME SHIGEO
NAKA AKIO
Application Number:
PCT/JP2007/053164
Publication Date:
September 07, 2007
Filing Date:
February 21, 2007
Export Citation:
Assignee:
NIPPON CATALYTIC CHEM IND (JP)
UEDA KENICHI
OTOME SHIGEO
NAKA AKIO
UEDA KENICHI
OTOME SHIGEO
NAKA AKIO
International Classes:
C08L33/14; C08F220/26
Foreign References:
| JP2000178399A | 2000-06-27 | |||
| JPH1072543A | 1998-03-17 | |||
| JP2005314534A | 2005-11-10 | |||
| JP2002060424A | 2002-02-26 | |||
| JP2001151814A | 2001-06-05 | |||
| JP2005281589A | 2005-10-13 | |||
| JP2005162835A | 2005-06-23 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (2-6 Tenjinbashi 2-chom, Kita-ku Osaka-shi Osaka 41, JP)
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