Title:
RESIN COMPOSITION AND RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2020/240993
Kind Code:
A1
Abstract:
A resin composition containing a polymer (A) that includes at least a hydroxyphenyl (meth)acrylate-derived constituent unit and a phenylene di(meth)acrylate-derived constituent unit.
Inventors:
KINOSHITA TAKEHIRO (JP)
KAWAGUCHI YASUAKI (JP)
KOBAYASHI MASAYUKI (JP)
HAYASHI SHUNSUKE (JP)
ZHOU ZHENGWEI (JP)
KAWAGUCHI YASUAKI (JP)
KOBAYASHI MASAYUKI (JP)
HAYASHI SHUNSUKE (JP)
ZHOU ZHENGWEI (JP)
Application Number:
PCT/JP2020/011356
Publication Date:
December 03, 2020
Filing Date:
March 16, 2020
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
C08F220/30; C08L33/04; G03F7/023
Domestic Patent References:
| WO2013015055A1 | 2013-01-31 |
Foreign References:
| JP2007204448A | 2007-08-16 | |||
| JP2012067059A | 2012-04-05 | |||
| JP2015215453A | 2015-12-03 | |||
| JP2007033517A | 2007-02-08 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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