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Patent Searching and Data


Title:
RESIN COMPOSITION AND FILM
Document Type and Number:
WIPO Patent Application WO/2021/251491
Kind Code:
A1
Abstract:
An embodiment of the present invention provides a resin composition comprising a resin R containing a repeating unit having a partial structure represented by general formula (I) or (II). In general formula (I), QA represents an ester bond represented in the formula, RA represents a substituent, n1 represents an integer of 1-5, * represents a binding site with the remainder of the repeating unit, and ** represents a binding site with a phenyl group in the formula. In general formula (II), QB represents a linking group or a single bond other than the ester bond represented by QA in formula (I), RB represents a substituent, n2 represents an integer of 1-5, and * represents a binding site with the remainder of the repeating unit. Here, at least one RB represents a hydroxy group.

Inventors:
MIYOSHI HANAE (JP)
FURUKAWA SHIGEKI (JP)
Application Number:
PCT/JP2021/022336
Publication Date:
December 16, 2021
Filing Date:
June 11, 2021
Export Citation:
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Assignee:
TOPPAN INC (JP)
International Classes:
B32B27/00; B32B27/30; B65D65/40; B65D81/24; C08F12/04; C08F20/30; C08F20/52; C08G18/62; C08K5/00; C08L25/02; C08L33/04; C08L33/24; C08L33/26; G02B1/14; G02B1/18; G03F7/038; G03F7/039
Foreign References:
JP2011209679A2011-10-20
JP2014186309A2014-10-02
JP2016090667A2016-05-23
JP2017140820A2017-08-17
JP2010072540A2010-04-02
Other References:
See also references of EP 4166322A4
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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