Title:
RESIN COMPOSITION AND RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2023/181953
Kind Code:
A1
Abstract:
A resin film is formed using a resin composition containing a carboxyl group-containing resin, a corrosion inhibitor having a solubility parameter (SP value) ranging from 17.0 (MPa)1/2 to 25.5 (MPa)1/2 inclusive, and a crosslinking agent.
Inventors:
KAMATA KOHEI (JP)
TSUTSUMI TAKASHI (JP)
TSUTSUMI TAKASHI (JP)
Application Number:
PCT/JP2023/008926
Publication Date:
September 28, 2023
Filing Date:
March 08, 2023
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
C08L101/08; C08G59/42; C08K5/34; C08K5/544; C08L63/00
Domestic Patent References:
| WO2019065246A1 | 2019-04-04 | |||
| WO2019049604A1 | 2019-03-14 |
Foreign References:
| JP2001064568A | 2001-03-13 | |||
| JP2018080106A | 2018-05-24 | |||
| JP2019127507A | 2019-08-01 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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