Title:
RESIN COMPOSITION FOR FORMING HIGHLY FLATTENING FILMS
Document Type and Number:
WIPO Patent Application WO/2008/029706
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a resin composition for forming flatting films which have high transparency and high flattening effect and are suitable for protection films and flattening films for the electrode or color filter to be used in liquid crystal displays, organic EL displays and so on; and cured flattening films. [MEANS FOR SOLVING PROBLEMS] A resin composition for forming flattening films which comprises (A) an acrylic polymer having a number-average molecular weight of 2,000 to 25,000, (B) a compound having two or more unsaturated double bonds in one molecule, (C) a compound capable of generating an acid on heating, (D) a heat-crosslinking compound except ones capable of crosslinking by the catalysis of the acid generated from the component (C), and (E) a solvent; and cured films made from the composition.
Inventors:
HATANAKA TADASHI (JP)
Application Number:
PCT/JP2007/066895
Publication Date:
March 13, 2008
Filing Date:
August 30, 2007
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
HATANAKA TADASHI (JP)
HATANAKA TADASHI (JP)
International Classes:
C08L35/00; B32B27/30
Foreign References:
| JP2002323771A | 2002-11-08 | |||
| JPS6348351A | 1988-03-01 | |||
| JP2003064236A | 2003-03-05 | |||
| JPH1045849A | 1998-02-17 | |||
| JPH10265649A | 1998-10-06 | |||
| JPH10292083A | 1998-11-04 | |||
| JP2001164072A | 2001-06-19 |
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (Shin-Ochanomizu UrbanTrinity 2, Kandasurugadai 3-chom, Chiyoda-ku Tokyo 62, JP)
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