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Patent Searching and Data


Title:
RESIN COMPOSITION FOR FORMING POLYPROPYLENE FILM, POLYPROPYLENE FILM, AND MULTILAYER BODY
Document Type and Number:
WIPO Patent Application WO/2023/218848
Kind Code:
A1
Abstract:
The present invention provides a resin composition for forming a polypropylene film, the resin composition containing: a polypropylene resin; a hindered amine light stabilizer that has a function of trapping carbon radicals; and a hydroxylamine-based antioxidant that has a primary antioxidant function and a secondary antioxidant function.

Inventors:
TAKAYANAGI KOSUKE (JP)
OKEYA YUTA (JP)
Application Number:
PCT/JP2023/014906
Publication Date:
November 16, 2023
Filing Date:
April 12, 2023
Export Citation:
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Assignee:
TOPPAN INC (JP)
International Classes:
C08L23/12; C08J5/18; C08K5/32; C08K5/3435
Domestic Patent References:
WO2020089268A12020-05-07
Foreign References:
JPH11263886A1999-09-28
JPS60101132A1985-06-05
JP2005530002A2005-10-06
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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