Title:
RESIN COMPOSITION FOR FORMING PROTECTION FILM AND PROTECTION FILM
Document Type and Number:
WIPO Patent Application WO/2018/021272
Kind Code:
A1
Abstract:
Provided are: a resin composition on which laser ablation processing can be performed and from which a protection film having a peeling resistance can be formed, the protection film itself being removable after the processing; and a protection film. The resin composition for forming a protection film contains a polyvinyl acetal, a light absorbing agent, and a solvent.
Inventors:
IWAI YU (JP)
SAWANO MITSURU (JP)
SAWANO MITSURU (JP)
Application Number:
PCT/JP2017/026785
Publication Date:
February 01, 2018
Filing Date:
July 25, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L29/14; C08K5/00
Foreign References:
| JPH09258445A | 1997-10-03 | |||
| JPH11119450A | 1999-04-30 | |||
| JP2000103620A | 2000-04-11 | |||
| JPH09311488A | 1997-12-02 | |||
| JPH08311363A | 1996-11-26 | |||
| JPH0470667A | 1992-03-05 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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