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Title:
RESIN COMPOSITION FOR FORMING RECEIVING LAYERS, RECEIVING BASE OBTAINED USING SAME, PRINTED MATTER, CONDUCTIVE PATTERN, AND ELECTRICAL CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2013/035582
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition for forming receiving layers, which is capable of forming a receiving layer that is capable of supporting a fluid such as an ink, exhibits excellent adhesion to various supporting bodies, and has excellent printability without causing bleeding of a fluid such as an ink. The present invention relates to a resin composition for forming receiving layers, which contains a urethane resin (A), a vinyl polymer (B) and an aqueous medium (C), and which is characterized in that the urethane resin (A) has a hydrophilic group and from 2,000 mmol/kg to 5,500 mmol/kg of an aliphatic cyclic structure relative to the total amount of the urethane resin (A).

Inventors:
SAITOU YUKIE (JP)
FUJIKAWA WATARU (JP)
SHIRAKAMI JUN (JP)
Application Number:
PCT/JP2012/071683
Publication Date:
March 14, 2013
Filing Date:
August 28, 2012
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
SAITOU YUKIE (JP)
FUJIKAWA WATARU (JP)
SHIRAKAMI JUN (JP)
International Classes:
B41M5/00; B41J2/01; B41M1/30; B41M5/50; B41M5/52; H05K3/10
Foreign References:
JP2011042046A2011-03-03
JP2002370443A2002-12-24
JP2001232936A2001-08-28
JP2009049124A2009-03-05
Other References:
See also references of EP 2620290A4
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
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Claims:



 
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