Title:
RESIN COMPOSITION FOR FORMING REPLICA MOLD, REPLICA MOLD AND PATTERN FORMING METHOD USING SAID REPLICA MOLD
Document Type and Number:
WIPO Patent Application WO/2018/092848
Kind Code:
A1
Abstract:
The present invention provides a resin composition which is capable of forming a replica mold for imprinting, said replica mold being capable of forming a pattern with high accuracy, while enabling easy removal of a residual film. A resin composition for forming a replica mold according to the present invention contains (A) a thermoplastic or thermosetting resin that has a light transmittance of 50% or more at least at one wavelength within the range of 200-450 nm and (B) a compound that has a function of absorbing or scattering light rays that have the above-described wavelength so that 0.5-50 parts by weight of the component (B) is contained per 100 parts by weight of the component (A). The resin (A) is preferably an olefin resin or a silicone resin.
Inventors:
MIYAKE HIROTO (JP)
TSUTSUMI KIYOHARU (JP)
TSUTSUMI KIYOHARU (JP)
Application Number:
PCT/JP2017/041288
Publication Date:
May 24, 2018
Filing Date:
November 16, 2017
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
C08L101/00; B29C33/38; B29C59/02; C08K3/00; C08K5/04; C08K5/16; C08L23/00; C08L83/04; H01L21/027
Domestic Patent References:
| WO2009093661A1 | 2009-07-30 | |||
| WO2008132903A1 | 2008-11-06 |
Foreign References:
| JP2009166486A | 2009-07-30 | |||
| JP2008207475A | 2008-09-11 | |||
| JP2016225226A | 2016-12-28 | |||
| JP2004304097A | 2004-10-28 |
Other References:
See also references of EP 3543294A4
Attorney, Agent or Firm:
GOTO & CO. (JP)
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