Title:
RESIN COMPOSITION FOR FORMING UNDERLAYER FILM, LAYERED BODY, PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING IMPRINT FORMING KIT AND DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/027843
Kind Code:
A1
Abstract:
Provided are a resin composition for forming an underlayer film in which a residual film after mold pressing is of low thickness and the incidence of variation in line width distribution after processing is minimal. Also provided are a layered body, a pattern formation method, and a method for manufacturing an imprint forming kit and device. A resin composition for forming an underlayer film, the resin composition containing: a resin having at least one group selected from a group represented by general formula (A), a group represented by general formula (B), an oxiranyl group, and an oxetanyl group; a nonionic surfactant; and a solvent. Ra1 represents a hydrogen atom or a methyl group, Rb1 and Rb2 each independently represent a group selected from a C1-20 unsubstituted straight or branched alkyl group and a C3-20 unsubstituted cycloalkyl group, Rb3 represents a group selected from a C2-20 unsubstituted straight or branched alkyl group and a C3-20 unsubstituted cycloalkyl group, and Rb2 and Rb3 may be bonded to each other to form a ring.
Inventors:
OOMATSU TADASHI (JP)
KITAGAWA HIROTAKA (JP)
GOTO YUICHIRO (JP)
KITAGAWA HIROTAKA (JP)
GOTO YUICHIRO (JP)
Application Number:
PCT/JP2015/073292
Publication Date:
February 25, 2016
Filing Date:
August 20, 2015
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B29C59/02; C09D201/06; B32B27/00; C09D5/00; C09D7/12; C09D133/14; H01L21/027
Domestic Patent References:
| WO2014157226A1 | 2014-10-02 | |||
| WO2013154075A1 | 2013-10-17 | |||
| WO2011086757A1 | 2011-07-21 | |||
| WO2013051735A1 | 2013-04-11 | |||
| WO2013191228A1 | 2013-12-27 | |||
| WO2011118797A1 | 2011-09-29 | |||
| WO2010116808A1 | 2010-10-14 |
Foreign References:
| JP2007101762A | 2007-04-19 | |||
| JP2006176746A | 2006-07-06 | |||
| JP2000344856A | 2000-12-12 | |||
| JPS62290705A | 1987-12-17 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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