Title:
RESIN COMPOSITION HAVING EXCELLENT ADHESION AND ELECTRICAL CONDUCTIVITY, AND MOLDED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/221417
Kind Code:
A1
Abstract:
The present invention relates to a resin composition having excellent adhesion and electrical conductivity, and a molded product thereof. The present invention relates to a technology that provides low surface resistance and excellent conductivity by including carbon filler in an adhesive resin that can provide high surface friction unlike conventional methods of applying an adhesive in order to provide adhesion or adding an anti-static agent in order to provide conductivity.
Inventors:
LEE JAE HYEOK (KR)
KANG WON JUN (KR)
KANG CHUL EE (KR)
BAE SEONG SOO (KR)
SONG HAN SOO (KR)
KANG WON JUN (KR)
KANG CHUL EE (KR)
BAE SEONG SOO (KR)
SONG HAN SOO (KR)
Application Number:
PCT/KR2021/005275
Publication Date:
November 04, 2021
Filing Date:
April 27, 2021
Export Citation:
Assignee:
HANWHA SOLUTIONS CORP (KR)
International Classes:
C08K3/04; C08L23/08; C08L23/16; C08L53/00; C08L101/00
Foreign References:
| KR102085500B1 | 2020-03-05 | |||
| JP2002292804A | 2002-10-09 | |||
| KR100873870B1 | 2008-12-15 | |||
| KR101003345B1 | 2010-12-22 | |||
| JP2019014488A | 2019-01-31 |
Attorney, Agent or Firm:
KIM, Chang Deok (KR)
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