Title:
RESIN COMPOSITION HAVING EXCELLENT RECOVERABILITY AND MULTILAYER STRUCTURE USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/117864
Kind Code:
A1
Abstract:
A resin composition which contains, relative to 100 parts by mass of a polyolefin (A), from 0.1 to 20 parts by mass of an ethylene-vinyl alcohol copolymer (B), from 0.1 to 20 parts by mass of an acid-modified polyolefin (C) and from 0.1 to 10 parts by mass of an acid-modified polyolefin (D), wherein: the component (B) has an ethylene unit content of from 15 to 60% by mole and a saponification degree of 85% by mole or more; the component (A) has a density of 0.89 g/cm3 or more but less than 0.97 g/cm3; the component (C) has a density of 0.89 g/cm3 or more but less than 0.97 g/cm3; the component (D) has a density of 0.85 g/cm3 or more but less than 0.89 g/cm3; and the glass transition temperature thereof as determined by dynamic viscoelasticity measurement is -30°C or less. This resin composition has good melt moldability; and the amount of degradation products of this resin composition adhering to a screw or a die is suppressed even in cases where melt molding is carried out continuously for a long period of time. In addition, a molded article which has excellent impact resistance at low temperatures is able to be achieved by using this resin composition.
More Like This:
Inventors:
ITO YU (JP)
SHIMIZU YUJI (JP)
SUZUKI MAKOTO (JP)
SHIMIZU YUJI (JP)
SUZUKI MAKOTO (JP)
Application Number:
PCT/JP2020/046261
Publication Date:
June 17, 2021
Filing Date:
December 11, 2020
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
B32B1/02; B32B27/32; B32B7/027; B65D65/40; C08L23/02; C08L23/26; C08L29/04
Domestic Patent References:
| WO2019021996A1 | 2019-01-31 | |||
| WO1996001873A1 | 1996-01-25 |
Foreign References:
| JP2006022131A | 2006-01-26 | |||
| CN109749238A | 2019-05-14 | |||
| JPH09104815A | 1997-04-22 |
Attorney, Agent or Firm:
SETOUCHI INTERNATIONAL PATENT FIRM (JP)
Download PDF: