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Title:
RESIN COMPOSITION, HEAT-CONDUCTIVE FLEXIBLE SHEET USING SAME, AND HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/051740
Kind Code:
A1
Abstract:
A heat-conductive flexible sheet is provided which is a non-silicone material, has excellent flexibility and excellent durability such as resistance to thermal aging, moist heat and thermal shock; also provided are a heat dissipation structure which uses said heat-conductive flexible sheet, and a resin composition which has excellent handling properties in the kneading process during manufacture of the heat-conductive flexible sheet, and which can be optimally used as a binder material of the heat-conductive flexible sheet. This resin composition contains a block urethane prepolymer, a prescribed epoxy compound and a curing catalyst, wherein the block urethane prepolymer is formed by blocking, with an aromatic hydroxy compound, isocyanate groups at a terminal of the reaction product of an aliphatic diisocyanate compound and a hydrogenated polybutadiene-type polyol having a hydroxyl group on both terminals; this heat-conductive flexible sheet is formed by curing a mixed composition containing said resin composition and a heat-conductive inorganic filler; and the heat dissipation structure uses said heat-conductive flexible sheet.

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Inventors:
YOSHIMOTO MITSUHIKO (JP)
SHIMOYAMA TAKAHIRO (JP)
IIZUKA MAMI (JP)
Application Number:
PCT/JP2017/029893
Publication Date:
March 22, 2018
Filing Date:
August 22, 2017
Export Citation:
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Assignee:
NISSHINBO HOLDINGS INC (JP)
International Classes:
C08G18/40; C08G18/10; C08G18/80; C08K9/04; C08L75/04; F21V29/503; H01L23/36; H05K7/20
Foreign References:
JPS5495400A1979-07-27
JPH10279838A1998-10-20
JPH07268051A1995-10-17
JPH1160677A1999-03-02
JPH02238019A1990-09-20
JPH04264121A1992-09-18
JPH04246462A1992-09-02
JPH04255754A1992-09-10
US3066997A1962-12-04
JP2002080617A2002-03-19
JP2012251089A2012-12-20
JP2009013237A2009-01-22
Other References:
See also references of EP 3514188A4
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Download PDF:
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