Title:
RESIN COMPOSITION FOR HEAT-DISSIPATING GAP FILLER, HEAT-DISSIPATING GAP FILLER, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/058547
Kind Code:
A1
Abstract:
This resin composition for a heat-dissipating gap filler contains a maleic anhydride-modified polybutadiene, a hydroxyl group-modified polybutadiene, a thermally conductive filler and an antioxidant. The content of the antioxidant is 0.01 mass% or more if the total amount of the resin composition for a heat-dissipating gap filler is taken to be 100 mass%. The thermal conductivity of the resin composition for a heat-dissipating gap filler after being cured is 1.0 W/m·K or more.
Inventors:
HAYASHI KATSUHIKO (JP)
TAKAI JUNKI (JP)
TAKAI JUNKI (JP)
Application Number:
PCT/JP2022/036404
Publication Date:
April 13, 2023
Filing Date:
September 29, 2022
Export Citation:
Assignee:
TOKYO PRINTING INK MFG CO LTD (JP)
International Classes:
C08L15/00; C08K3/01; C09K5/14
Domestic Patent References:
| WO2020100102A2 | 2020-05-22 | |||
| WO2019220291A1 | 2019-11-21 |
Foreign References:
| CN108752628A | 2018-11-06 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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