RESIN COMPOSITION INCLUDING ETHYLENE/VINYL ALCOHOL COPOLYMER, AND MOLDED OBJECT AND PACKAGING MATERIAL BOTH COMPRISING SAME

Title:

RESIN COMPOSITION INCLUDING ETHYLENE/VINYL ALCOHOL COPOLYMER, AND MOLDED OBJECT AND PACKAGING MATERIAL BOTH COMPRISING SAME

Document Type and Number:

WIPO Patent Application WO/2019/130989

Kind Code:

A1

Abstract:

A resin composition which includes, as a main component, an ethylene/vinyl alcohol copolymer (A) produced using an azonitrile-based polymerization initiator, wherein the ethylene/vinyl alcohol copolymer (A) has an ethylene unit content of 20-60 mol%, a degree of saponification of 85 mol% or higher, and a content (NI) of nitrogen element derived from the polymerization initiator of 5-60 ppm, and the proportion of the content (NF) of nitrogen element in a dried solid obtained by the following operation (X) to the nitrogen element content (NI), NF/NI, is 0.65-0.99. The resin composition is less apt to generate voids even when melt-molded at high temperatures and is suitable for use in high-speed melt-molding processes at high temperatures. Operation (X): A solution obtained by dissolving 5 g of the resin composition in 100 g of 1,1,1,3,3,3,3-hexafluoro-2-propanol is added dropwise to 1,000 g of methanol being stirred, and the resultant sediment is taken out and then dried to obtain a dried solid.

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Inventors:

YOSHIDA KENTARO (JP)

Application Number:

PCT/JP2018/044240

Publication Date:

July 04, 2019

Filing Date:

November 30, 2018

Export Citation:

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Assignee:

KURARAY CO (JP)

International Classes:

C08L29/04; B32B27/28; B65D65/02; B65D65/40; C08K5/09

Domestic Patent References:

WO2011118648A1	2011-09-29
WO2017047806A1	2017-03-23
WO2017047806A1	2017-03-23

Foreign References:

JP2011202052A	2011-10-13
JP2012207054A	2012-10-25
JP2001234007A	2001-08-28
JP2002060413A	2002-02-26

Other References: