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Title:
RESIN COMPOSITION INCLUDING ETHYLENE/VINYL ALCOHOL COPOLYMER, AND MOLDED OBJECT AND PACKAGING MATERIAL BOTH COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2019/130989
Kind Code:
A1
Abstract:
A resin composition which includes, as a main component, an ethylene/vinyl alcohol copolymer (A) produced using an azonitrile-based polymerization initiator, wherein the ethylene/vinyl alcohol copolymer (A) has an ethylene unit content of 20-60 mol%, a degree of saponification of 85 mol% or higher, and a content (NI) of nitrogen element derived from the polymerization initiator of 5-60 ppm, and the proportion of the content (NF) of nitrogen element in a dried solid obtained by the following operation (X) to the nitrogen element content (NI), NF/NI, is 0.65-0.99. The resin composition is less apt to generate voids even when melt-molded at high temperatures and is suitable for use in high-speed melt-molding processes at high temperatures. Operation (X): A solution obtained by dissolving 5 g of the resin composition in 100 g of 1,1,1,3,3,3,3-hexafluoro-2-propanol is added dropwise to 1,000 g of methanol being stirred, and the resultant sediment is taken out and then dried to obtain a dried solid.

Inventors:
YOSHIDA, Kentaro (7471, Tamashimaotoshima, Kurashiki-sh, Okayama 50, 〒7138550, JP)
Application Number:
JP2018/044240
Publication Date:
July 04, 2019
Filing Date:
November 30, 2018
Export Citation:
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Assignee:
KURARAY CO., LTD. (1621, Sakazu Kurashiki-sh, Okayama 01, 〒7100801, JP)
International Classes:
C08L29/04; B32B27/28; B65D65/02; B65D65/40; C08K5/09
Domestic Patent References:
WO2011118648A12011-09-29
WO2017047806A12017-03-23
Foreign References:
JP2011202052A2011-10-13
JP2012207054A2012-10-25
JP2001234007A2001-08-28
JP2002060413A2002-02-26
Attorney, Agent or Firm:
SETOUCHI INTERNATIONAL PATENT FIRM (Growth-2 Building, 4-9-1 Ima, Kita-ku, Okayama-sh, Okayama 75, 〒7000975, JP)
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