Title:
RESIN COMPOSITION, RESIN COMPOSITION FOR INJECTION MOLDING, MOLDED ARTICLE AND HOUSING FOR ELECTRIC/ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/122582
Kind Code:
A1
Abstract:
Disclosed is a resin composition that has superior moldability, resistance to bleedout, resistance to sublimation and flame resistance, and provides a molded article having flame resistance as well as high levels of both impact strength and bending strength. Specifically disclosed is a resin composition containing a cellulose ester (A), a thermoplastic resin (B) having an aromatic ring on the main chain, a plasticizer (C) containing a polymer having repeated structural units and a number average molecular weight of 500 - 5000, and a phosphorus-containing flame retardant (D) with a molecular weight of 400 - 1500.
Inventors:
NORO Masaki (())
野呂 正樹 (())
野呂 正樹 (())
Application Number:
JP2011/057696
Publication Date:
October 06, 2011
Filing Date:
March 28, 2011
Export Citation:
Assignee:
FUJIFILM Corporation (26-30, Nishiazabu 2-chome Minato-k, Tokyo 31, 〒1060031, JP)
富士フイルム株式会社 (〒31 東京都港区西麻布２丁目２６番３０号 Tokyo, 〒1060031, JP)
NORO Masaki (())
富士フイルム株式会社 (〒31 東京都港区西麻布２丁目２６番３０号 Tokyo, 〒1060031, JP)
NORO Masaki (())
International Classes:
C08L1/10; B29C45/00; C08K5/521; C08L27/12; C08L101/00; C08L101/02; G03G15/00
Attorney, Agent or Firm:
TAKAMATSU Takeshi et al. (Koh-Ei Patent Firm, Toranomon East Bldg. 9F 7-13, Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
Claims: