RESIN COMPOSITION FOR INSULATING FILM

WIPO Patent Application WO/2019/139028

A1

The present invention provides: a resin composition which is for an insulating film and from which a cured product having a further reduced dielectric constant and dielectric loss tangent is obtained; a photosensitive resin composition; a method for producing a cured relief pattern using the photosensitive resin composition; and a semiconductor device provided with the cured relief pattern. This resin composition for an insulating film includes: a polyimide precursor; and a compound which is a polyimide precursor containing a polyamic acid ester, a thermal imidization accelerator, and a solvent, wherein the thermal imidization accelerator has a carboxyl group and an amino group or imino group which is deprotected by heat and exhibits basicity, and does not accelerate the imidization of the polyimide precursor before the protective group is released. Furthermore, provided is a photosensitive resin composition which is for an insulating film and includes a photopolymerization initiator. In particular, the present invention is suitably used for forming a redistribution layer in the manufacturing of a semiconductor device.

OHASHI TAKUYA (JP)
IINUMA YOSUKE (JP)
HATTORI HAYATO (JP)
USUI YUKI (JP)
SAWADA KAZUHIRO (JP)

PCT/JP2019/000319

July 18, 2019

January 09, 2019

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NISSAN CHEMICAL CORP (JP)

C08G73/12; C08K5/205; C08K5/3445; C08L79/08; H01L21/312

WO2013168675A1	2013-11-14
WO2010114103A1	2010-10-07
WO2017064984A1	2017-04-20
WO2017209177A1	2017-12-07
WO2015072554A1	2015-05-21

TSUKUNI & ASSOCIATES et al. (JP)

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