Title:
RESIN COMPOSITION FOR INSULATIVE COATING MATERIAL, METAL COATING MATERIAL, POLYIMIDE RESIN MOLDED ARTICLE, METHOD FOR PRODUCING INSULATIVE COATING MATERIAL, AND RESIN MOLDED ARTICLE FOR INSULATIVE COATING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/130908
Kind Code:
A1
Abstract:
A resin composition for an insulative coating material, the composition comprising: a solvent; a polyimide resin precursor and/or a polyimide resin; and an additive, wherein the polyimide resin precursor and/or the polyimide resin includes a compound represented by formula (0) and/or a compound represented by formula (0') and a compound having a functional group that reacts with a terminal ring-closure product of a compound represented by formula (0) and/or a compound represented by formula (0'), the additive has a molecular weight of 1000 or less, and the difference between the solubility parameter (SP value) of the additive and the solubility parameter of the solvent is 0.1-20 (cal/cm3)1/2. (R' represents a hydrogen atom or an alkyl group. Ra represents a tetracarboxylate residue. Rb represents a diamine residue. p and q each represent an arbitrarily defined integer.)
Inventors:
INATOMI YU (JP)
SUGIYAMA JIRO (JP)
SUGIYAMA JIRO (JP)
Application Number:
PCT/JP2021/042741
Publication Date:
June 23, 2022
Filing Date:
November 22, 2021
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08G73/10; C08L79/08; C09D7/47; C09D179/08; H01B3/30
Domestic Patent References:
| WO2020158736A1 | 2020-08-06 |
Foreign References:
| JPH10158397A | 1998-06-16 | |||
| JP2020123448A | 2020-08-13 | |||
| JP2019059927A | 2019-04-18 |
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (JP)
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