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Title:
RESIN COMPOSITION AND LAMINATE HAVING LAYER COMPRISING SAID RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/209431
Kind Code:
A1
Abstract:
The purpose of the present invention is to obtain: a resin composition having further improved adhesion to a base material layer when used as an adhesive layer in a laminate; and a laminate having superior adhesive strength between layers including a layer comprising said resin composition.　The present invention relates to a resin composition and a laminate including a layer of said resin composition, the resin composition being characterized by containing 5-70 weight% of a propylene-based polymer (A), 30-95 weight% of a soft propylene-based polymer (B), 0.1-20 weight% of a propylene-based polymer graft-modified with an ethylenically unsaturated monomer (C), 0-20 weight% of polyethylene (D), and 1-30 weight% of an ethylene-α-olefin random copolymer (E) (where the total amount of (A), (B), (C), (D), and (E) is 100 weight%).

Inventors:
HAYAKAWA AKIO (JP)
YOSHIMOTO KOYA (CN)
Application Number:
PCT/JP2022/007219
Publication Date:
October 06, 2022
Filing Date:
February 22, 2022
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
B32B27/32; B32B15/085; B32B15/20; C08L23/06; C08L23/08; C08L23/14; C08L23/16; C08L23/26; C09J123/12
Domestic Patent References:
WO2019176403A12019-09-19
WO2008093648A12008-08-07
Foreign References:
JP2018154683A2018-10-04
JP2012188662A2012-10-04
JP2004269688A2004-09-30
JP2020111745A2020-07-27
JPH11293059A1999-10-26
JP2014172916A2014-09-22
JP2018188631A2018-11-29
JP2004269688A2004-09-30
JP2012188662A2012-10-04
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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