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Patent Searching and Data


Title:
RESIN COMPOSITION AND LAMINATE IN WHICH SAME IS USED
Document Type and Number:
WIPO Patent Application WO/2018/042995
Kind Code:
A1
Abstract:
[Problem] To provide: a resin composition that has exceptional adhesiveness with respect to bare copper, can maintain adhesiveness with respect to bare copper even when exposed to a high-temperature, high-humidity environment for an extended period of time, and conforms to a high-rated temperature standard or can obtain certification of said standard without a crosslinking step; and a laminate that can be suitably used as a coating material for a flexible flat cable, the resin composition being used in the laminate. [Solution] A resin composition for an adhesive layer of a laminate, the resin composition containing (A) 55-85% by mass of acid-modified polypropylene resin and (B) 15-45% by mass of a copolymer of ethylene and one or more comonomers selected from the group consisting of vinyl acetate, alkyl methacrylates, and alkyl acrylates, and being configured such that the sum of component (A) and component (B) is 100% by mass, and the acid-modification level of component (A) is 0.5-10 mol%.

Inventors:
ZENNYOJI Yoshihiro (101 Kanda-Awajicho 2-chome, Chiyoda-k, Tokyo 36, 〒1018336, JP)
INOMATA Sayuri (101 Kanda-Awajicho 2-chome, Chiyoda-k, Tokyo 36, 〒1018336, JP)
Application Number:
JP2017/027690
Publication Date:
March 08, 2018
Filing Date:
July 31, 2017
Export Citation:
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Assignee:
RIKEN TECHNOS CORPORATION (101 Kanda-Awajicho 2-chome, Chiyoda-ku Tokyo, 36, 〒1018336, JP)
International Classes:
C08L23/26; B32B27/28; B32B27/32; B32B27/36; C08L23/08; C09J123/08; C09J123/26; H01B7/08
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (Kyowa Patent & Law Office, Nippon Life Marunouchi Building 1-6-6, Marunouchi, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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