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Patent Searching and Data


Title:
RESIN COMPOSITION, LAMINATE AND PROCESS FOR PRODUCTION THEREOF, STRUCTURE AND PROCESS FOR PRODUCTION THEREOF, AND PROCESS FOR PRODUCTION OF ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/053548
Kind Code:
A1
Abstract:
The present invention relates to a resin composition comprising: a polyimide silicone which has, in a silicone moiety therein, a crosslinking part at which a crosslinking reaction occurs by heating at a second temperature, wherein the crosslinking can proceed more effectively by heating at a third temperature that is higher than the second temperature compared with the case when the heating is carried out at the second temperature; and a solvent which can be volatiled by heating at a first temperature that is lower than the second temperature.

Inventors:
KAKUTA JUNICHI (JP)
Application Number:
JP2011/074047
Publication Date:
April 26, 2012
Filing Date:
October 19, 2011
Export Citation:
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Assignee:
ASAHI GLASS CO LTD (?1008405, JP)
KAKUTA JUNICHI (JP)
International Classes:
C08L79/08; B32B27/16; B32B27/28; C08F299/02; C08G73/10; C08J3/24; H01L29/786
Foreign References:
JPH07268098A1995-10-17
JPH115844A1999-01-12
JPH08218034A1996-08-27
JP2003200527A2003-07-15
JPH07324133A1995-12-12
JP2003213130A2003-07-30
JP2007326358A2007-12-20
Attorney, Agent or Firm:
OGURI Shohei et al. (Eikoh Patent Firm, Toranomon East Bldg. 10F 7-13, Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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Claims: