Title:
RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/209044
Kind Code:
A1
Abstract:
This resin composition contains a maleimine compound (A), and at least one compound selected from a group that consists of an organic compound (B) having an acidic site and an organic compound (C) having an acid anhydride site.
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| JPH03215546 | THICKENER FOR AQUEOUS SILICA COMPOSITION |
Inventors:
TAKIGUCHI TAKENORI (JP)
HIGASHIGUCHI KOHEI (JP)
KIDA TSUYOSHI (JP)
HIGASHIGUCHI KOHEI (JP)
KIDA TSUYOSHI (JP)
Application Number:
PCT/JP2017/019906
Publication Date:
December 07, 2017
Filing Date:
May 29, 2017
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08L39/00; C08K3/00; C08K5/09; C08K5/13; C08K5/1539; C08K5/42; C08K5/52; C08L33/08; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| WO2015127179A1 | 2015-08-27 | |||
| WO2013035205A1 | 2013-03-14 |
Foreign References:
| JP2013110422A | 2013-06-06 |
Other References:
See also references of EP 3467028A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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