Title:
RESIN COMPOSITION, RESIN LAYER, PERMANENT ADHESIVE, ADHESIVE FOR TEMPORARY BONDING, LAYERED FILM, PROCESSED WAFER, AND PROCESS FOR PRODUCING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/138447
Kind Code:
A1
Abstract:
The present invention provides a resin composition with which a substrate for electronic-circuit formation or a substrate for semiconductor-circuit formation can be bonded to a supporting substrate and which, in the state of being bonding a substrate for electronic-circuit formation or substrate for semiconductor-circuit formation that has a thickness of 1-100 µm, has excellent heat resistance. The resin composition undergoes no change in adhesive strength even through production steps for electronic components, semiconductor devices, etc., and can be thereafter removed at room temperature under mild conditions. The present invention further provides: an adhesive, a resin layer, a layered film, and a processed wafer each comprising or obtained using the resin composition; and a process for producing an electronic component or semiconductor device using these. The resin composition of the present invention comprises (a) a polyimide resin having a specific structure and (b) a crosslinking agent containing a fluorene group.
Inventors:
ARIMOTO SHINJI (JP)
FUJIWARA TAKENORI (JP)
OKAZAWA TORU (JP)
FUJIWARA TAKENORI (JP)
OKAZAWA TORU (JP)
Application Number:
PCT/JP2017/003927
Publication Date:
August 17, 2017
Filing Date:
February 03, 2017
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L79/08; B32B27/00; B32B27/34; B32B27/38; C08K3/00; C08K5/5415; C08L63/00; C08L83/04; C09D7/12; C09D163/00; C09D179/08; C09D183/04; C09J11/04; C09J11/06; C09J163/00; C09J179/08; C09J183/04; H01L21/304
Domestic Patent References:
| WO2014115637A1 | 2014-07-31 |
Foreign References:
| JP2012162676A | 2012-08-30 | |||
| JP2008139862A | 2008-06-19 | |||
| JP2016020471A | 2016-02-04 | |||
| JP2010053223A | 2010-03-11 |
Download PDF: