Title:
RESIN COMPOSITION, LIGHT-SHIELDING FILM, AND SUBSTRATE WITH PARTITION WALL
Document Type and Number:
WIPO Patent Application WO/2021/200357
Kind Code:
A1
Abstract:
Disclosed is a resin composition which is for forming a partition wall on a substrate of a display device, has excellent weather resistance, and is relatively inexpensive, and with which a partition wall having both high reflectivity for whole visible light and high light-shielding property for blue light can be formed. This resin composition contains a resin, a photopolymerization initiator or a quinone diazide compound, a white pigment, an organic silver compound, and a reducing agent. Examples of the reducing agent include a compound containing at least two phenolic hydroxyl groups in a molecule or a compound containing an enediol group.
Inventors:
IIZUKA EISUKE (JP)
SUWA MITSUHITO (JP)
KOBAYASHI HIDEYUKI (JP)
SUWA MITSUHITO (JP)
KOBAYASHI HIDEYUKI (JP)
Application Number:
PCT/JP2021/011831
Publication Date:
October 07, 2021
Filing Date:
March 23, 2021
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08F290/00; C08G59/20; C08L101/00; G02B5/20; G02F1/1335; G02F1/13357
Domestic Patent References:
| WO2020008969A1 | 2020-01-09 |
Foreign References:
| JP2004295116A | 2004-10-21 | |||
| JP2018084823A | 2018-05-31 | |||
| JP2017173812A | 2017-09-28 |
Attorney, Agent or Firm:
TANIGAWA AND PARTNERS, PATENT FIRM (JP)
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