RESIN COMPOSITION FOR LOW-DIELECTRIC MATERIAL, FILM FOR MULTILAYER SUBSTRATE, MULTILAYER SUBSTRATE, METHOD FOR PRODUCING RESIN COMPOSITION FOR LOW-DIELECTRIC MATERIAL, METHOD FOR PRODUCING FILM FOR MULTILAYER SUBSTRATE, AND METHOD FOR PRODUCING MULTILAYER SUBSTRATE

Title:

Document Type and Number:

WIPO Patent Application WO/2022/202886

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide: a resin composition which has a small dielectric constant, a small dielectric loss tangent, high transparency, high solubility and high heat resistance and can be used suitably as a low-dielectric material; a film for a multilayer substrate, in which the resin composition is used; a multilayer substrate; and methods respectively for producing the resin composition, the film and the multilayer substrate. Provided are: a resin composition for a low-dielectric material, which contains a triazine-containing polyether compound having a specific repeating unit; a film for a multilayer substrate; a multilayer substrate; a method for producing a resin composition for a low-dielectric material; a method for producing a film for a multilayer substrate; and a method for producing a multilayer substrate.

Inventors:

OISHI YOSHIYUKI (JP)
SHIBASAKI YUJI (JP)
TSUKAMOTO TADASHI (JP)

Application Number:

PCT/JP2022/013425

Publication Date:

September 29, 2022

Filing Date:

March 23, 2022

Export Citation:

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Assignee:

NATIONAL UNIV CORPORATION IWATE UNIV (JP)

International Classes:

C08L71/10; B32B27/00; B32B27/38; C08G65/40; C08L63/00

Foreign References:

JP2001503077A	2001-03-06
JPH06184300A	1994-07-05
CN106589349A	2017-04-26
CN106589348A	2017-04-26