Title:
RESIN COMPOSITION FOR LOW-PRESSURE INSERT MOLDING OF ELECTRIC AND ELECTRONIC COMPONENTS, SEALING BODY FOR ELECTRIC AND ELECTRONIC COMPONENTS, AND METHOD FOR PRODUCING SEALING BODY FOR ELECTRIC AND ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2012/014823
Kind Code:
A1
Abstract:
Provided is a resin composition for a sealing body for electric and electronic components. The resin composition has good adhesion with electric and electronic substrates having crosslinked polyethylene-covered wires, and the like, and has excellent durability against environmental loads such as cold-hot cycle loads and high-temperature, high-humidity loads. Also provided is a method for producing the sealing body for electric and electronic components. A resin composition for low-pressure insert molding of electric and electronic components, said resin composition containing, per 100 mass% of the resin composition, 50 mass% or more of a polyolefin, 5 to 30 mass% of an acid-modified polyolefin, and 10 to 45 mass% of a crystalline copolyester, and having a melt flow rate (MFR) of 60 g/10 minutes or greater as determined at 190ºC under a load of 2,160 g.
Inventors:
NAKAJIMA, Tadashi (1-1 Katata 2-chome, Ohtsu-sh, Shiga 92, 〒5200292, JP)
Application Number:
JP2011/066761
Publication Date:
February 02, 2012
Filing Date:
July 22, 2011
Export Citation:
Assignee:
TOYO BOSEKI KABUSHIKI KAISHA (2-8 Dojima Hama 2-chome, Kita-ku Osaka-sh, Osaka 30, 〒5308230, JP)
東洋紡績株式会社 (〒30 大阪府大阪市北区堂島浜二丁目２番８号 Osaka, 〒5308230, JP)
東洋紡績株式会社 (〒30 大阪府大阪市北区堂島浜二丁目２番８号 Osaka, 〒5308230, JP)
International Classes:
C08L23/02; B29C45/14; C08L23/26; C08L51/06; C08L53/00; C08L67/00; B29K23/00; B29L31/34
Attorney, Agent or Firm:
UEKI, Kyuichi et al. (Fujita-Toyobo Building 9th Floor, 1-16 Dojima 2-chome, Kita-ku, Osaka-sh, Osaka 03, 〒5300003, JP)
Claims:
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