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Title:
RESIN COMPOSITION, MATERIAL FOR MELT MOLDING, MULTILAYER STRUCTURE, AND MATERIAL FOR PACKAGING LIQUID
Document Type and Number:
WIPO Patent Application WO/2019/103075
Kind Code:
A1
Abstract:
A resin composition having suppressed coloration and containing an ethylene–vinyl alcohol copolymer (A), a styrene thermoplastic elastomer (B), and a sorbic acid ester (C). The sorbic acid ester (C) content is 0.00001–10 ppm per weight of resin composition.

Inventors:
USUI SHINTARO (JP)
IKESHITA MINAKO (JP)
Application Number:
PCT/JP2018/043113
Publication Date:
May 31, 2019
Filing Date:
November 22, 2018
Export Citation:
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Assignee:
NIPPON SYNTHETIC CHEM IND CO LTD (JP)
International Classes:
C08L29/04; B65D65/30; B65D65/40; C08K5/101; C08L23/08; C08L53/02
Domestic Patent References:
WO2016163370A12016-10-13
WO2017082063A12017-05-18
Foreign References:
JP2015071439A2015-04-16
JP2018145396A2018-09-20
JPH1087923A1998-04-07
JPS63304043A1988-12-12
JPH07173348A1995-07-11
Other References:
See also references of EP 3715418A4
Attorney, Agent or Firm:
SAITOH Yukihiko et al. (JP)
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