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Patent Searching and Data


Title:
RESIN COMPOSITION, MATERIAL FOR MELT MOLDING, MULTILAYERED STRUCTURE, AND FILM FOR AGRICULTURE
Document Type and Number:
WIPO Patent Application WO/2019/103076
Kind Code:
A1
Abstract:
Provided is resin composition in which staining is suppressed, said resin composition including: an ethylene vinyl alcohol-based copolymer (A) that has an ethylene structural unit content of 20-60mol%; an ethylene vinyl acetate-based copolymer saponified product (B) that has an ethylene structural unit content of 70mol% or greater; and a sorbic acid ester (C), wherein the sorbic acid ester (C) content is 0.00001-10ppm by weight of the resin composition.

Inventors:
USUI SHINTARO (JP)
IKESHITA MINAKO (JP)
Application Number:
PCT/JP2018/043114
Publication Date:
May 31, 2019
Filing Date:
November 22, 2018
Export Citation:
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Assignee:
NIPPON SYNTHETIC CHEM IND CO LTD (JP)
International Classes:
C08L29/04; A01G13/00; C08K5/101; C08L23/08
Domestic Patent References:
WO2015050221A12015-04-09
Foreign References:
JP2012153861A2012-08-16
JP2012193327A2012-10-11
JP2009097010A2009-05-07
JP2000312538A2000-11-14
JP2011046929A2011-03-10
JP2002234971A2002-08-23
Other References:
See also references of EP 3715416A4
Attorney, Agent or Firm:
SAITOH Yukihiko et al. (JP)
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