Title:
RESIN COMPOSITION, AND MEMBER FOR CONDUCTION TEST
Document Type and Number:
WIPO Patent Application WO/2018/221640
Kind Code:
A1
Abstract:
Provided is a resin composition capable of effectively preventing a conduction test target member from scratching, and thus capable of effectively improving the reliability of a conduction test. This resin composition contains conductive particles, a thermosetting compound, and a thermosetting agent, wherein the content of the conductive particles in 100 wt% of the resin composition is at least 50 wt%, and the elongation at break of a cured product obtained by heating components other than the conductive particles in the resin composition at 130°C for 30 minutes is 10-100% as measured according to JIS K6251.
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Inventors:
MAHARA SHIGEO (JP)
Application Number:
PCT/JP2018/020915
Publication Date:
December 06, 2018
Filing Date:
May 31, 2018
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; G01R1/073; H01R11/01
Domestic Patent References:
| WO2011132658A1 | 2011-10-27 |
Foreign References:
| JP2016222804A | 2016-12-28 | |||
| JP2007019006A | 2007-01-25 | |||
| JP2015038865A | 2015-02-26 | |||
| JPH0384078A | 1991-04-09 | |||
| JPH02133422A | 1990-05-22 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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