Title:
RESIN, COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR FORMING CIRCUIT PATTERN, AND METHOD FOR REFINING RESIN
Document Type and Number:
WIPO Patent Application WO/2022/176571
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a novel resin or the like that is particularly useful as a film-forming material for lithography. Said problem can be solved by a resin including a structural unit represented by formula (1) or (1)'. (In the formulae, the variable portions are as defined in the description.)
Inventors:
HORIUCHI JUNYA (JP)
MAKINOSHIMA TAKASHI (JP)
SATO TAKASHI (JP)
ECHIGO MASATOSHI (JP)
MAKINOSHIMA TAKASHI (JP)
SATO TAKASHI (JP)
ECHIGO MASATOSHI (JP)
Application Number:
PCT/JP2022/003346
Publication Date:
August 25, 2022
Filing Date:
January 28, 2022
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G8/20; G03F7/11; G03F7/20; G03F7/26; H01L21/027
Domestic Patent References:
| WO2015137486A1 | 2015-09-17 | |||
| WO2020158931A1 | 2020-08-06 | |||
| WO2019013293A1 | 2019-01-17 | |||
| WO2018155495A1 | 2018-08-30 |
Foreign References:
| JP2014219559A | 2014-11-20 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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