Title:
RESIN COMPOSITION, AND METHOD FOR MANUFACTURING INSULATED ELECTRIC WIRE USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/199473
Kind Code:
A1
Abstract:
A resin composition comprises a non-crystalline polymer, an oligomer produced by polymerizing a monomer that is of the same type as a monomer constituting the polymer, and a heat-curable molecule, wherein the average molecular weight of the oligomer is equal to or smaller than 1/10 of the average molecular weight of the polymer.
Inventors:
TAKEDA SHINTAROU (JP)
AMOU SATORU (JP)
ARAI TADASHI (JP)
ARAYA KOUTAROU (JP)
KOBAYASHI TOSHIYUKI (JP)
AMOU SATORU (JP)
ARAI TADASHI (JP)
ARAYA KOUTAROU (JP)
KOBAYASHI TOSHIYUKI (JP)
Application Number:
PCT/JP2013/066267
Publication Date:
December 18, 2014
Filing Date:
June 12, 2013
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
C08L101/00; C08F290/06; C08G59/62; C08L71/12; H01B3/42; H01B7/02
Domestic Patent References:
| WO2012081705A1 | 2012-06-21 | |||
| WO2012049743A1 | 2012-04-19 |
Foreign References:
| JP2010215783A | 2010-09-30 | |||
| JP2005290124A | 2005-10-20 |
Attorney, Agent or Firm:
ISONO Michizo (JP)
Michizo Isono (JP)
Michizo Isono (JP)
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