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Patent Searching and Data


Title:
RESIN COMPOSITION, METHOD FOR PRODUCING SAID RESIN COMPOSITION, AND THERMALLY CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2020/145083
Kind Code:
A1
Abstract:
The present invention is a resin composition and the like comprising an epoxy resin, a curing agent, and an inorganic filler, wherein the inorganic filler is dispersed in the epoxy resin. The inorganic filler contains two or more types of inorganic particles including a whisker-like filler.

Inventors:
TABUCHI AKIHIRO (JP)
Application Number:
PCT/JP2019/049974
Publication Date:
July 16, 2020
Filing Date:
December 20, 2019
Export Citation:
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Assignee:
NITTO SHINKO CORP (JP)
International Classes:
B29C70/88; C08G59/24; C08G59/62; C08J5/18; C08K3/28; C08K7/04; C08L63/00; C09K5/14
Foreign References:
JP2013256637A2013-12-26
JP2004018617A2004-01-22
JP2001316564A2001-11-16
JP2019000777A2019-01-10
JP2019000779A2019-01-10
JP2010094887A2010-04-30
Other References:
See also references of EP 3909997A4
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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