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Patent Searching and Data


Title:
RESIN COMPOSITION AND METHOD FOR PRODUCING THREE-DIMENSIONALLY SHAPED OBJECT USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/131352
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin composition for forming three-dimensionally shaped objects having high dimensional accuracy. In order to achieve the purpose, the resin composition is used in a three-dimensional shaping method wherein either forming a thin layer that comprises a particulate resin composition and selectively irradiating the thin layer with laser light are repeated or melt-extruding a resin composition into a filament shape and forming a layer of the filament-shaped extruded resin composition are repeated, thereby forming a three-dimensionally shaped object. The resin composition of the present invention has a particulate or filament shape, comprises polysaccharide nanofibers and a resin, and has a content of the polysaccharide nanofibers of 1-70 mass%. In the resin composition, the maximum value of loss modulus at temperatures in the range of (melting temperature)±20°C is 10-1,000 times the minimum value of loss modulus at temperatures in the range of (melting temperature)±20°C.

Inventors:
MIZOGUCHI, Keisuke
Application Number:
JP2017/044160
Publication Date:
July 19, 2018
Filing Date:
December 08, 2017
Export Citation:
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Assignee:
KONICA MINOLTA, INC. (2-7-2, Marunouchi Chiyoda-k, Tokyo 15, 〒1007015, JP)
International Classes:
C08L101/00; B29C67/00; B33Y10/00; B33Y70/00; C08L1/00; C08L77/00
Domestic Patent References:
WO2016059986A12016-04-21
WO2016129693A12016-08-18
WO2017141779A12017-08-24
Foreign References:
JP2017170881A2017-09-28
Other References:
ADVINCULA RIGOBERTO: "3D printing of nanocomposite materials and challenges in properties", 252ND ACS NATIONAL MEETING & EXPOSITION, 21 August 2016 (2016-08-21), Philadelphia, PA, United States
Attorney, Agent or Firm:
WASHIDA, Kimihito (8th Floor, Shinjuku First West Bldg. 1-23-7, Nishi-Shinjuku, Shinjuku-k, Tokyo 23, 〒1600023, JP)
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