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Patent Searching and Data


Title:
RESIN COMPOSITION, METHOD FOR PRODUCING THREE-DIMENSIONAL MOLDING USING SAME, AND THREE-DIMENSIONAL MOLDING
Document Type and Number:
WIPO Patent Application WO/2019/059183
Kind Code:
A1
Abstract:
Provided is a resin composition from which a three-dimensional molding can be produced at an appropriate speed and with high dimensional accuracy, wherein the obtained three-dimensional molding has high strength. This resin composition is used in a method for producing a three-dimensional molding composed of a cured product of a liquid resin composition by selectively irradiating the liquid resin composition with active energy rays. The resin composition includes at least: a first polymerizable compound, in a liquid state at room temperature, having radical polymerizability; a second polymerizable compound, in a liquid state at room temperature, having no radical polymerizability; and a filler, wherein the surface of the filler is covered with the second polymerizable compound.

Inventors:
KOJIMA, Takeshi
Application Number:
JP2018/034504
Publication Date:
March 28, 2019
Filing Date:
September 18, 2018
Export Citation:
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Assignee:
KONICA MINOLTA, INC. (2-7-2, Marunouchi Chiyoda-k, Tokyo 15, 〒1007015, JP)
International Classes:
C08F2/44; B29C64/165; B29C64/264; C08G18/00; C08G59/00; C08K9/06; C08L33/06; C08L63/00; C08L101/00; B33Y10/00; B33Y70/00; B33Y80/00
Foreign References:
JP2007514805A2007-06-07
JP2005060673A2005-03-10
JP2015089943A2015-05-11
JP2010265408A2010-11-25
JP2017513729A2017-06-01
JP2017007116A2017-01-12
JP2001342204A2001-12-11
Other References:
ANONYMOUS: "Continuous liquid interface production method- Principle and structure of photo-fabrication 3D printer", SLA, DLP, 9 March 2017 (2017-03-09), Retrieved from the Internet [retrieved on 20181201]
Attorney, Agent or Firm:
WASHIDA, Kimihito (8th Floor, Shinjuku First West Bldg. 1-23-7, Nishi-Shinjuku, Shinjuku-k, Tokyo 23, 〒1600023, JP)
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