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Patent Searching and Data


Title:
RESIN COMPOSITION, MOLDED ARTICLE, AND ELECTRICAL WIRE
Document Type and Number:
WIPO Patent Application WO/2019/026689
Kind Code:
A1
Abstract:
Provided are a resin composition whereby a molded article can be provided in which whitening upon bending is effectively suppressed, and an electric wire and a molded article in which the resin composition is used. A resin composition including 50 to 99 parts by mass of a polyphenylene ether resin and 50 to 1 part by mass of a styrene-olefin block copolymer having a number-average molecular weight of less than 100,000 and a content of styrene-derived constituent units of 15 to 40% by mass.

Inventors:
YANAGISAWA Kenichi (6-2 Higashiyawata 5-chome, Hiratsuka-sh, Kanagawa 16, 〒2540016, JP)
Application Number:
JP2018/027687
Publication Date:
February 07, 2019
Filing Date:
July 24, 2018
Export Citation:
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Assignee:
MITSUBISHI ENGINEERING-PLASTICS CORPORATION (9-2 Higashi-shinbashi 1-chome, Minato-ku Tokyo, 21, 〒1050021, JP)
International Classes:
C08L71/12; B32B1/00; B32B27/00; B32B27/18; C08K3/22; C08K5/098; C08K5/49; C08L23/06; C08L53/02; H01B3/42; H01B3/44; H01B7/295
Domestic Patent References:
WO2016208896A22016-12-29
WO2014075291A12014-05-22
Foreign References:
JP2016102217A2016-06-02
JP2015120891A2015-07-02
JP2015091938A2015-05-14
JP2015071652A2015-04-16
JP2015071653A2015-04-16
JP2012041502A2012-03-01
JP2017071677A2017-04-13
JP2017160328A2017-09-14
Attorney, Agent or Firm:
SIKS & CO. (8th Floor, Kyobashi-Nisshoku Bldg. 8-7, Kyobashi 1-chome, Chuo-k, Tokyo 31, 〒1040031, JP)
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