Title:
RESIN COMPOSITION, MOLDED ARTICLE, AND ELECTRICAL WIRE
Document Type and Number:
WIPO Patent Application WO/2019/026689
Kind Code:
A1
Abstract:
Provided are a resin composition whereby a molded article can be provided in which whitening upon bending is effectively suppressed, and an electric wire and a molded article in which the resin composition is used. A resin composition including 50 to 99 parts by mass of a polyphenylene ether resin and 50 to 1 part by mass of a styrene-olefin block copolymer having a number-average molecular weight of less than 100,000 and a content of styrene-derived constituent units of 15 to 40% by mass.
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Inventors:
YANAGISAWA KENICHI (JP)
Application Number:
PCT/JP2018/027687
Publication Date:
February 07, 2019
Filing Date:
July 24, 2018
Export Citation:
Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
C08L71/12; B32B1/00; B32B27/00; B32B27/18; C08K3/22; C08K5/098; C08K5/49; C08L23/06; C08L53/02; H01B3/42; H01B3/44; H01B7/295
Domestic Patent References:
| WO2016208896A2 | 2016-12-29 | |||
| WO2014075291A1 | 2014-05-22 |
Foreign References:
| JP2016102217A | 2016-06-02 | |||
| JP2015120891A | 2015-07-02 | |||
| JP2015091938A | 2015-05-14 | |||
| JP2015071652A | 2015-04-16 | |||
| JP2015071653A | 2015-04-16 | |||
| JP2012041502A | 2012-03-01 | |||
| JP2017071677A | 2017-04-13 | |||
| JP2017160328A | 2017-09-14 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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