Title:
RESIN COMPOSITION, MOLDED ARTICLE, AND FILM
Document Type and Number:
WIPO Patent Application WO/2023/026982
Kind Code:
A1
Abstract:
This resin composition contains a polyimide and an acrylic resin. The polyimide contains, as a tetracarboxylic dianhydride component, an alicyclic tetracarboxylic dianhydride such as 1,2,3,4-cyclobutane tetracarboxylic dianhydride, and contains, as a diamine component, a diamine having a perfluoroalkyl group such as 2,2'-bis(trifluoromethyl)benzidine. In the polyimide, the amount of the alicyclic tetracarboxylic dianhydride with respect to the total amount of tetracarboxylic dianhydride components is preferably 1-80 mol%.
Inventors:
OGAWA KOHEI (JP)
KAMITE JUN (JP)
KAMITE JUN (JP)
Application Number:
PCT/JP2022/031388
Publication Date:
March 02, 2023
Filing Date:
August 19, 2022
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L79/08; C08G73/10; C08J5/18; C08L33/06
Domestic Patent References:
| WO2012018121A1 | 2012-02-09 | |||
| WO2021132279A1 | 2021-07-01 |
Foreign References:
| KR101831598B1 | 2018-02-23 | |||
| JP2013209498A | 2013-10-10 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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