RESIN COMPOSITION AND MOLDED ARTICLE INCLUDING SAME

WIPO Patent Application WO/2012/098840

A1

The present invention provides a polyamide resin composition which has an adequate melt viscosity although an electrically conductive filler is contained therein and which has excellent moldability and is excellent in terms of electrical conductivity, low-temperature impact resistance, and fuel-barrier properties. This polyamide resin composition comprises a polyamide that comprises dicarboxylic acid units, 50 mol% or more of which are accounted for by terephthalic acid units and/or naphthalenedicarboxylic acid units, and diamine units, 60 mol% or more of which are accounted for by units of a C4-18 aliphatic diamine, and that has a terminal-amino-group content of 5-60 µmol/g, a resin modified with an unsaturated compound having a carboxy group and/or an acid anhydride group, and an electrically conductive filler in specific amounts. In the composition, the difference between the number of moles (MI) of the terminal amino groups of the polyamide and the number of moles (MII) of the carboxy groups and acid anhydride groups of the modified resin, per g of the sum of the polyamide and the modified resin, is -5.0 µmol or greater but less than 4.0 µmol and MII is greater than 4.0 µmol.

JP6836316	Reinforced polyamide molding composition and injection molded products manufactured from it
JP7370452	Crystalline polyamide resin, resin composition and molded body
JP2013122001	POLYAMIDE RESIN COMPOSITION FOR AUTOMOBILE EXTERIOR PART AND AUTOMOBILE EXTERIOR PART INCLUDING THE POLYAMIDE RESIN COMPOSITION

KUMAZAWA HIROE (JP)
YAMASAKI HIROKI (JP)
SUZUKI HIDEAKI (JP)
TAMURA KOZO (JP)

PCT/JP2012/000162

July 26, 2012

January 12, 2012

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KURARAY CO (JP)
KUMAZAWA HIROE (JP)
YAMASAKI HIROKI (JP)
SUZUKI HIDEAKI (JP)
TAMURA KOZO (JP)

C08L77/06; C08G69/26; C08K3/04; C08K7/06; C08L101/08; F16L11/06

WO2004016693A1

2004-02-26

JPH10292106A	1998-11-04
JP2003055549A	2003-02-26
JP2006152256A	2006-06-15
JP2010209247A	2010-09-24
JP2002275313A	2002-09-25
JP2006124659A	2006-05-18
JP2008179753A	2008-08-07
JP2004099845A	2004-04-02
JPH03103469A	1991-04-30
JP2001055458A	2001-02-27
JP2008179753A	2008-08-07

See also references of EP 2666823A4

KAMADA, Koichi et al. (JP)
Koichi Kamata (JP)

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